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Our Services and Capabilities
EE Technologies, Inc. is fully equipped to handle printed circuit board production from procurement of bare boards and other raw materials to providing finished assemblies. Second to our people, our equipment is our most important asset. We use state of the art technology and maintain our equipment according to manufacturer specifications. Some of our capabilities include: :
SMT Services
- 2 Philips/Assembleon SMT lines specializing in odd shapes and prototypes
- 2 Philips/Assembleon SMT lines specializing in general production in Reno
- 2 Philips/Assembleon SMT lines specializing in general production in Empalme
- 1 Prototype and Backup SMT line in Reno
- Powerful reflow profiling software and techniques
Click Here for Detailed Specs on our SMT Equipment...
Screen Printing
- DEK Horizon and ELA solder paste printers
- Speedline’s MPM solder paste printer
- Asymtek Millennium adhesive chip bonding application
Click Here for Detailed Specs on our Screen Printing Services
Ovens and Coating Machines
- 3 Vitronic-Soltec XMP2 (9 Series) Reflow ovens
- 3 Vitronic-Soltec XPM (8 Series) Reflow Ovens
- Speedline’s Omniflow 10 with on board refrigerated chiller
- Conformal coating with Ultra-Violet curing in Empalme
Click Here for Detailed Specs on our Ovens and Coating Machines
Inspection/Test Services
- 3 Teradyne Automated Inspection machine (AOI)
- Teradyne In-Circuit Test
- 2 Cr Technologies X-ray machine for BGA and other inspection
- Air Vac Premium Rework System (including BGA repair)
- Teradyne In-Circuit Test
- SPEA Flying Probe tester
- Functional test capability
Click Here for Detailed Specs on our Inspection / Test Equipment...
Through Hole Services
- Component prepping and stuffing
- ERSA Wave Solder
- ERSA Selective Solder machine
- 4 Vitronics-Soltec Wave soldering machines
Click Here for Detailed Specs on our Through Hole Equipment...
Mechanical Assembly Services
- Complete box build services
- Procurement of plastics, sheet metal, graphics, and hardware
- Use of work instructions and skills to assemble complex units
- Serialization, labeling, and customized packaging including inserts/manuals
- Additional operations including programming and test
