| Reno, NV Equipment Listing |
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Manufacturer |
Model/Name |
Main Functions |
Features/Capabilities |
Maximum PCB Size |
Minimum PCB size |
PCB Thickness |
Speed/Efficiency |
Special Requirements |
| Machine type |
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| X-ray |
|
CR Technology |
CRX 1=
000 |
Real =
time X-ray
imaging |
BGA, =
Micro BGA
and Semi Conductor X-ray inspection (can also detect trace anomalies), pr=
ints
out X-ray photos |
|
N/A w=
ith use of
tray |
N/A
| Depen=
ds on PCB
layout (typically 30 sec to 3 minutes per board) |
N/A
|
| AOI |
|
Terady=
ne |
Optima
7300 |
Automated
component inspection |
T/H
and SMT automated inspection to +/- 1 micron accuracy |
W24”
(609.6mm) x L24” (609.6mm) with W22” (558.8mm) x L24”
(609.6mm) inspection area. |
W2”
(50.8mm) x L2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
Depends
on PCB layout (typically 30 sec to 3 minutes per board) |
N/A |
| AOI |
|
Terady=
ne |
Optima
7301 |
Automated
component inspection |
T/H
and SMT automated inspection to +/- 1 micron accuracy |
W24”
(609.6mm) x L24” (609.6mm) with W22” (558.8mm) x L24”
(609.6mm) inspection area. |
W2”
(50.8mm) x L2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
Depends
on PCB layout (typically 30 sec to 3 minutes per board) |
N/A |
| Flying Probe |
|
SPEA |
4040C |
Multi
Mode PCB Testing |
Production,
Prototype, boards with accessibility problems, high production volume |
686x610
mm (27''x24'')
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N/A |
N/A |
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| Pick & Place |
|
Philips
Assembleon |
Topaz |
Surface
mount component placement |
Places
0402 through BGA, QFP’s up to 1.26” x 1.26” (32mm x
32mm). Up to 50 feeders, an=
d 10
tray capacity. |
W
9.8” (250mm) x L 18” (458mm) |
W
2” (50.8mm) x L 3.35” (85mm) |
.024”
(.6mm) to .118” (3mm) |
8000 - 12,000 c/p hr. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Pick & Place |
|
Philips
Assembleon |
Topaz
X (qty 3 machines) |
Surface
mount component placement |
Places
0201 through BGA, QFP’s up to 1.26” x 1.26” (32mm x 32m=
m)
up to 90 feeder capacity. |
W
17.4” (441.96mm) x L 18” (457.2mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
015”
(.381mm) to .15” (3.816mm) |
15,000
– 18,000 c/p hr. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Pick & Place |
|
Philips
Assembleon |
Topaz
XII (qty 4 machines) |
Surface
mount component placement |
Places
0201 through BGA, QFP’s up to 32mm x 32 mm, up to 90 feeder capacit=
y. |
W
17.4” (443mm) x L 18” (458mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
17,000
- 20,000 c/p hr |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Pick & Place |
|
Philips
Assembleon |
Emerald
X |
Large
SMT component placement |
Places
0603 through BGA, sockets, QFP’s up to 45mm x 45 mm, up to 90 feeder
capacity. |
W
17.4” (441.96mm) x L 18” (457.2mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
6,800-7,000 c/p hr. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Screen Printer |
|
DEK
| ELA |
Solder
paste application |
Fine
pitch down to .012" (.3mm) pitch |
W
17.5 (444.5mm) x L 19” (482.6mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
15
seconds per print. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Screen Printer |
|
DEK
| Horizon
03 |
Solder
paste application |
Fine
pitch down to .012" (.3mm) pitch |
W
17.5 (444.5mm) x L 19” (482.6mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
15
seconds per print. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Screen Printer |
|
DEK
| Horizon
03i (qty 2 machines) |
Solder
paste application |
Fine
pitch down to .012" (.3mm) pitch |
W
17.5 (444.5mm) x L 19” (482.6mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
15
seconds per print. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Screen Printer |
|
MPM
| Ultraprint
1500 |
Solder
paste application |
Fine
pitch down to .012” (.3mm) pitch, BGA down to .02” (.51mm) pi=
tch |
W
20.5” (520.7mm) x L 16” (406.4mm) with W 20” (508mm) x L
16” (406.4mm) printable area |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
15
seconds per print. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Adhesive Dispenser |
|
Asymte=
k |
Millennium |
Surface
mount chip bonder application |
Non-contact
dot dispensing, rated for 0603 dot dispensing (can do 0402’s), +/-
0.0009843” (.025mm) repeatability, can import CAD data. |
W
19.5” (495.3mm) x L 20” (508mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
3.3’
(1m) p/second X/Y velocity |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Convection Oven |
|
Vitron=
ics Soltec |
XPM
820 (qty 2 machines) |
Solder
paste reflow/chip bonder cure |
8
heat zones/2 cooling zones, KIC 2000 profiling, double sided PCB’s<=
/td>
| 18”
x no limit |
2”
for double sided (none if single sided) |
N/A |
24”
(609.6mm) per min (avg) |
N/A |
| Convection Oven |
|
Vitron=
ics Soltec |
XPM2
940 |
Solder
paste reflow/chip bonder cure |
9
heat zones, 4 cooling zones, KIC 2000 profiling, double sided PCB's. Equipped with N2 blanketing and =
polar
cooling |
18"
x no limit |
2”
for double sided (none if single sided) |
N/A |
24”
(609.6mm) per min (avg) |
N/A |
| Convection Oven |
|
Speedl=
ine
Technologies |
Omniflo-10 |
Solder
paste reflow/chip bonder cure |
10
heat zones, refrigerated onboard chiller, KIC 2000 thermal profiling, dou=
ble
sided PCB's |
20”
(508mm) |
2”(50mm)
for double sided, none if single sided |
N/A |
26”
(637mm) per min (avg) |
N/A |
| Stencil Cleaner |
|
EMC Gl=
obal |
Spirit
30 IPA |
Isopropyl
Alcohol based Printer Stencil cleaner |
Front
loading, innovative pneumatic spray system 31.5" x 30" x
3" Envelope Size |
N/A |
N/A |
N/A |
3
minute cycle per stencil (avg) |
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| Selective Solder |
|
Ersa
| Versa
Flow |
High
speed automated selective soldering of T/H components |
2
modules, 2 preheat modules, can run pallets, |
19.69”
(500mm) |
2.95”
(75mm) |
N/A |
.66’
(.2m) to 32.8’ (10m) per sec |
.12”
(3mm) minimum scrap edge required, .35” (9mm) maximum component hei=
ght
at edge of board, 1.2” (30mm) bottom clearance. |
| Wave Solder |
|
Ersa
| EWS
500 |
Automated
T/H & SMT component wave soldering |
Flat
component assemblies, spray fluxer, +/- 1% temperature accuracy, solder
temperature 230C – 300C |
W
18” (457.2mm) x no limit.
Solderable area =3D W 17.5” (444.5mm) x no limit |
W
2” (50.8mm) x no limit |
N/A |
9.8’ (3m) /min |
.12”
(3mm) minimum scrap edge required,
1.2” (30mm) bottom clearance. |
| Wave Solder |
|
Vitron=
ics Soltec |
Delta
Wave |
Automated
T/H & SMT component wave soldering |
Flat
component assemblies, spray fluxer, +/- 1% temperature accuracy, solder
temperature 230C – 300C.
Select X debridging tool |
W
18” (457.2mm) x no limit.
Solderable area =3D W 17.5” (444.5mm) x no limit |
W
2” (50.8mm) x no limit |
N/A |
9.8’ (3m) /min |
.12”
(3mm) minimum scrap edge required,
1.2” (30mm) bottom clearance. |
| Wave Solder |
|
Vitron=
ics Soltec |
Delta
5 |
Automated
T/H & SMT component wave soldering |
Flat
component assemblies, spray fluxer, +/- 1% temp accuracy, solder temp 230C
– 300C. Select X
de-bridging tool |
W
18” (457.2mm) x no limit.
Solderable area =3D W 17.5” (444.5mm) x no limit |
W
2” (50.8mm) x no limit |
N/A |
9.8’ (3m) /min |
.12”
(3mm) minimum scrap edge required,
1.2” (30mm) bottom clearance. |
| Wash |
|
Techni=
cal
Devices |
NuClean
Poly SMT 318 |
Aqueous
PCB cleaner |
Removal
of flux and contaminants from PCB substrates, wash, rinse & air-knife
zones |
16”
(406.5mm) |
none |
N/A |
5
min (depends on product, typically 2.5’ (.762m) per minute |
N/A |
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/td>
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Test Equipment |
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SMT Equipment |
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Through Hole Equipment |
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| Guaymas,
Mexico Equipment Listing |
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Manufacturer |
Model/Name |
Main Functions |
Features/Capabilities |
Maximum PCB Size |
Minimum PCB size |
PCB Thickness |
Speed/Efficiency |
Special Requirements |
| Machine type |
|
|
| X-ray |
|
CR Technology |
CRX 2=
000 |
Real =
time X-ray
imaging |
BGA, =
Micro BGA
and Semi Conductor X-ray inspection (can also detect trace anomalies), pr=
ints
out X-ray photos |
|
N/A w=
ith use of
tray |
N/A
| Depen=
ds on PCB
layout (typically 30 sec to 3 minutes per board) |
|
| AOI |
|
Terady=
ne |
Optima
7301 |
Automated
component inspection |
T/H
and SMT automated inspection to +/- 1 micron accuracy |
W24”
(609.6mm) x L24” (609.6mm) with W22” (558.8mm) x L24”
(609.6mm) inspection area. |
W2”
(50.8mm) x L2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
Depends
on PCB layout (typically 30 sec to 3 minutes per board) |
|
| ICT |
|
Terady=
ne |
Z1888 |
Analogue/digital
PCB tester |
Multi
Scan Vectorless test,
non-multiplexed driver channel with high performance signal
interface. |
N/A |
N/A |
N/A |
Less
than one min per board (avg). |
Needs
PCB specific fixture |
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| Pick & Place |
|
Philips
Assembleon |
Topaz
XII (qty 4 machines) |
Surface
mount component placement |
Places
0201 through BGA, QFP’s up to 32mm x 32 mm, up to 90 feeder capacit=
y. |
W
17.4” (443mm) x L 18” (458mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
17,000
- 20,000 c/p hr |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Screen Printer |
|
DEK
| Horizon
03i (qty 2 machines) |
Solder
paste application |
Fine
pitch down to .012" (.3mm) pitch |
W
17.5 (444.5mm) x L 19” (482.6mm) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
15
seconds per print. |
PCB
smaller than 2" x 2&qu=
ot;
will require fixtures. Additional fees may apply |
| Convection Oven |
|
Vitron=
ics Soltec |
XPM2
940 (qty 2 machines) |
Solder
paste reflow/chip bonder cure |
9
heat zones, 4 cooling zones, double sided PCB's. Equipped with N2 blanketing and =
polar
cooling |
18"
x no limit |
2”
for double sided (none if single sided) |
N/A |
24”
(609.6mm) per min (avg) |
N/A |
| Curing
Oven |
|
Asymte=
k |
UV612 |
InLine
Ultraviolet Curing Oven |
Modular
Configuration, Cooler Running Temp. |
N/A |
W
2” (50.8mm) x L 2” (50.8mm) |
N/A |
8"(203mm)
per min (avg) |
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| Coating
Machine |
|
Asymte=
k |
C-740 |
Conformal
Coating of PCB's |
Consistent
uniform dispensing of a variety of conformal coating materials |
457
x 432 mm (18 x 17 in.) |
W
2” (50.8mm) x L 2” (50.8mm) |
.015”
(.381mm) to .15” (3.81mm) |
Depends
on PCB layout (typically 30 sec to 3 minutes per board) |
Machine
is currently configured for the use of Loctite 5293 material |
| Stencil Washer |
|
Austin=
American
Technology Corp |
SK810 |
Water
based surface mount stencil cleaner |
Top
loading with automated wash cycle.
Fits standard 29X29 inch stencil frame. |
N/A |
N/A |
N/A |
3
minute cycle per stencil (avg) |
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| Wave Solder |
|
Vitron=
ics Soltec |
Delta
Wave (qty 2 machines) |
Automated
T/H & SMT component wave soldering |
Flat
component assemblies, spray fluxer, +/- 1% temp accuracy, solder temp 230C
– 300C. Select X
de-bridging tool |
W
18” (457.2mm) x no limit.
Solderable area =3D W 17.5” (444.5mm) x no limit |
W
2” (50.8mm) x no limit |
N/A |
9.8’ (3m) /min |
.12”
(3mm) minimum scrap edge required,
1.2” (30mm) bottom clearance. |
| Wash |
|
WestKl=
een |
|
Aqueous
PCB cleaner |
Removal
of flux and contaminants from PCB substrates, wash, rinse & air-knife
zones |
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5
min (depends on product, typically 2.5’ (.762m) per minute |
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/td>
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Test Equipment |
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SMT Equipment |
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Through Hole Equipment |
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